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july 2003 the following document specifies spansion memory products that are now offered by both advanced micro devices and fujitsu. although the document is marked with the name of the company that orig- inally developed the specification, these products will be offered to customers of both amd and fujitsu. continuity of specifications there is no change to this datasheet as a result of offering the device as a spansion product. any changes that have been made are the result of normal datasheet improvement and are noted in the document revision summary, where supported. future routine revisions will occur when appropriate, and changes will be noted in a revision summary. continuity of ordering part numbers amd and fujitsu continue to support existing part numbers beginning with ?am? and ?mbm?. to order these products, please use only the ordering part numbers listed in this document. for more information please contact your local amd or fujitsu sales office for additional information about spansion memory solutions. am29f016d data sheet publication number 21444 revision e amendment 3 issue date june 4, 2004
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this data sheet states amd?s current technical specifications regarding the product described herein. this data sheet may be revised by subsequent versions or modifications due to changes in technical specifications. publication# 21444 rev: e amendment/ +3 issue date: june 4, 2004 am29f016d 16 megabit (2 m x 8-bit) cmos 5.0 volt-only, uniform sector flash memory distinctive characteristics 5.0 v 10%, single power supply operation ? minimizes system level power requirements manufactured on 0.23 m process technology ? compatible with 0.5 m am29f016 and 0.32 m am29f016b devices high performance ? access times as fast as 70 ns low power consumption ? 25 ma typical active read current ? 30 ma typical program/erase current ? 1 a typical standby current (standard access time to active mode) flexible sector architecture ? 32 uniform sectors of 64 kbytes each ? any combination of sectors can be erased ? supports full chip erase ? group sector protection: a hardware method of locking sector groups to prevent any program or erase operations within that sector group temporary sector group unprotect allows code changes in previously locked sectors embedded algorithms ? embedded erase algorithm automatically preprograms and erases the entire chip or any combination of designated sectors ? embedded program algorithm automatically writes and verifies bytes at specified addresses unlock bypass program command ? reduces overall programming time when issuing multiple program command sequences minimum 1,000,000 program/erase cycles per sector guaranteed 20-year data retention at 125 c ? reliable operation for the life of the system package options ? 48-pin and 40-pin tsop ? 44-pin so ? known good die (kgd) (see publication number 21551) compatible with jedec standards ? pinout and software compatible with single-power-supply flash standard ? superior inadvertent write protection data# polling and toggle bits ? provides a software method of detecting program or erase cycle completion ready/busy# output (ry/by#) ? provides a hardware method for detecting program or erase cycle completion erase suspend/erase resume ? suspends a sector erase operation to read data from, or program data to, a non-erasing sector, then resumes the erase operation hardware reset pin (reset#) ? resets internal state machine to the read mode
3 am29f016d general description the am29f016d is a 16 mbit, 5.0 volt-only flash mem - ory organized as 2,097,152 bytes. the 8 bits of data appear on dq0?dq7. the am29f016d is offered in 48-pin tsop, 40-pin tsop, and 44-pin so packages. the device is also available in known good die (kgd) form. for more information, refer to publication number 21551. this device is designed to be programmed in-system with the standard system 5.0 volt v cc supply. a 12.0 volt v pp is not required for program or erase operations. the device can also be programmed in standard eprom programmers. this device is manufactured using amd?s 0.23 m pro - cess technology, and offers all the features and bene - fits of the am29f016, which was manufactured using 0.5 m process technology. the standard device offers access times of 70, 90, 120, and 150 ns, allowing high-speed microprocessors to operate without wait states. to eliminate bus conten - tion, the device has separate chip enable (ce#), write enable (we#), and output enable (oe#) controls. the device requires only a single 5.0 volt power sup - ply for both read and write functions. internally gener - ated and regulated voltages are provided for the program and erase operations. the device is entirely command set compatible with the jedec single-power-supply flash standard . com - mands are written to the command register using stan - dard microprocessor write timings. register contents serve as input to an internal state-machine that con - trols the erase and programming circuitry. write cycles also internally latch addresses and data needed for the programming and erase operations. reading data out of the device is similar to reading from other flash or eprom devices. device programming occurs by executing the program command sequence. this initiates the embedded program algorithm?an internal algorithm that auto - matically times the program pulse widths and verifies proper cell margin. device erasure occurs by executing the erase com - mand sequence. this initiates the embedded erase algorithm?an internal algorithm that automatically preprograms the array (if it is not already programmed) before executing the erase operation. during erase, the device automatically times the erase pulse widths and verifies proper cell margin. the host system can detect whether a program or erase operation is complete by observing the ry/by# pin, or by reading the dq7 (data# polling) and dq6 (toggle) status bits . after a program or erase cycle has been completed, the device is ready to read array data or accept another command. the sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the data contents of other sectors. the device is fully erased when shipped from the factory. hardware data protection measures include a low v cc detector that automatically inhibits write opera - tions during power transitions. the hardware sector protection feature disables both program and erase operations in any combination of the sectors of mem - ory. this can be achieved via programming equipment. the erase suspend feature enables the user to put erase on hold for any period of time to read data from, or program data to, any sector that is not selected for erasure. true background erase can thus be achieved. the hardware reset# pin terminates any operation in progress and resets the internal state machine to reading array data. the reset# pin may be tied to the system reset circuitry. a system reset would thus also reset the device, enabling the system microprocessor to read the boot-up firmware from the flash memory. the system can place the device into the standby mode . power consumption is greatly reduced in this mode. amd?s flash technology combines years of flash memory manufacturing experience to produce the highest levels of quality, reliability and cost effective - ness. the device electrically erases all bits within a sector simultaneously via fowler-nordheim tunneling. the data is programmed using hot electron injection.
am29f016d 4 table of contents product selector guide . . . . . . . . . . . . . . . . . . . . . 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 connection diagrams . . . . . . . . . . . . . . . . . . . . . . 6 pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 8 logic symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 ordering information . . . . . . . . . . . . . . . . . . . . . . . 9 device bus operations . . . . . . . . . . . . . . . . . . . . 10 table 1. am29f016d device bus operations ................................ 10 requirements for reading array data ................................... 10 writing commands/command sequences ............................ 10 program and erase operation status .................................... 11 standby mode ........................................................................ 11 reset#: hardware reset pin ............................................... 11 output disable mode .............................................................. 11 table 2. sector address table........................................................ 12 autoselect mode ..................................................................... 13 table 3. am29f016d autoselect codes (high voltage method).... 13 sector group protection/unprotection.................................... 13 table 4. sector group addresses................................................... 13 temporary sector group unprotect ....................................... 13 figure 1. temporary sector group u nprotect operation................ 14 hardware data protection ...................................................... 14 low v cc write inhibit ...................................................................... 14 write pulse ?glitch? protection ........................................................ 14 logical inhibit .................................................................................. 14 power-up write inhibit .................................................................... 14 common flash memory interface (cfi) . . . . . . . 15 table 5. cfi query identification string .......................................... 15 table 6. system interface string..................................................... 15 table 7. device geometry definition .............................................. 16 table 8. primary vendor-specific extended query ........................ 16 command definitions . . . . . . . . . . . . . . . . . . . . . 17 reading array data ................................................................ 17 reset command..................................................................... 17 autoselect command sequence ............................................ 17 byte program command sequence ....................................... 17 unlock bypass command sequence.............................................. 18 figure 2. program operation .......................................................... 18 chip erase command sequence ........................................... 18 sector erase command sequence ........................................ 19 erase suspend/erase resume commands ........................... 19 figure 3. erase operation............................................................... 20 command definitions ............................................................. 21 table 9. am29f016d command definitions................................... 21 write operation status . . . . . . . . . . . . . . . . . . . . 22 dq7: data# polling ................................................................. 22 figure 4. data# polling algorithm ................................................... 22 ry/by#: ready/busy# ........................................................... 23 dq6: toggle bit i .................................................................... 23 dq2: toggle bit ii ................................................................... 23 reading toggle bits dq6/dq2 .............................................. 23 dq5: exceeded timing limits ................................................ 24 dq3: sector erase timer ....................................................... 24 figure 5. toggle bit algorithm........................................................ 24 table 10. write operation status................................................... 25 absolute maximum ratings. . . . . . . . . . . . . . . . . 26 figure 6. maximum negative overshoot waveform ...................... 26 figure 7. maximum positive overshoot waveform........................ 26 operating ranges . . . . . . . . . . . . . . . . . . . . . . . . . 26 dc characteristics . . . . . . . . . . . . . . . . . . . . . . . . 27 ttl/nmos compatible .......................................................... 27 cmos compatible.................................................................. 27 test conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 28 figure 8. test setup...................................................................... 28 table 11. test specifications ......................................................... 28 key to switching waveforms. . . . . . . . . . . . . . . . 28 ac characteristics . . . . . . . . . . . . . . . . . . . . . . . . 29 read-only operations............................................................. 29 figure 9. read operation timings ................................................. 29 figure 10. reset# timings .......................................................... 30 erase/program operations ..................................................... 31 figure 11. program operation timings.......................................... 32 figure 12. chip/sector erase operation timings .......................... 33 figure 13. data# polling timings (during embedded algorithms). 34 figure 14. toggle bit timings (during embedded algorithms) ...... 34 figure 15. dq2 vs. dq6................................................................. 35 figure 16. temporary sector group unprotect timings ................ 35 erase and program operations .............................................. 36 alternate ce# controlled writes .................................................... 36 figure 17. alternate ce# controlled write operation timings ...... 37 erase and programming performance . . . . . . . 38 latchup characteristics . . . . . . . . . . . . . . . . . . . . 38 tsop and so pin capacitance . . . . . . . . . . . . . . 38 data retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 physical dimensions . . . . . . . . . . . . . . . . . . . . . . 39 ts 040?40-pin standard thin small outline package ......... 39 tsr040?40-pin reverse thin small outline package......... 40 ts 048?48-pin standard thin small outline package ......... 41 tsr048?48-pin reverse thin small outline package......... 42 so 044?44-pin small outline package ................................ 43 revision summary . . . . . . . . . . . . . . . . . . . . . . . . 44 revision a (may 1997) ........................................................... 44 revision b (january 1998) ..................................................... 44 revision b+1 (january 1998) ................................................. 44 revision b+2 (april 1998)....................................................... 44 revision c (january 1999) ..................................................... 44 revision c+1 (march 23, 1999) .............................................. 44 revision c+2 (may 17, 1999) ................................................. 44 revision c+3 (july 2, 1999) ................................................... 44 revision d (november 16, 1999) ........................................... 44 revision e (may 19, 2000) ..................................................... 45 revision e+1 (december 4, 2000) ......................................... 45 revision e+2 (march 23, 2001) .............................................. 45 revision e+3 (may 27, 2004) ................................................. 45
5 am29f016d product selector guide note: see the ac characteristics section for more information. block diagram family part number am29f016d speed options (v cc = 5.0 v 10%) -70 -90 -120 -150 max access time (ns) 70 90 120 150 ce# access (ns) 70 90 120 150 oe# access (ns) 40 40 50 75 input/output buffers x-decoder y-decoder chip enable output enable logic erase voltage generator pgm voltage generator timer v cc detector state control command register v cc v ss we# ce# oe# stb stb dq0 ? dq7 sector switches ry/by# reset# data latch y-gating cell matrix address latch a0?a20
am29f016d 6 connection diagrams this device is also available in known good die (kgd) form. refer to publication number 21551 for more information. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 a19 a18 a17 a16 a15 a14 a13 a12 ce# v cc nc reset# a11 a10 a9 a8 a7 a6 a5 a4 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 a20 nc we# oe# ry/by# dq7 dq6 dq5 dq4 v cc v ss v ss dq3 dq2 dq1 dq0 a0 a1 a2 a3 40-pin standard tsop 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 a19 a18 a17 a16 a15 a14 a13 a12 ce# v cc nc reset# a11 a10 a9 a8 a7 a6 a5 a4 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 a20 nc we# oe# ry/by# dq7 dq6 dq5 dq4 v cc v ss v ss dq3 dq2 dq1 dq0 a0 a1 a2 a3 40-pin reverse tsop
7 am29f016d connection diagrams this device is also available in known good die (kgd) form. refer to publication number 21551 for more information. 1 24 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 nc nc nc a19 a18 a17 a16 a15 a14 a13 a12 ce# v cc nc reset# a11 a10 a9 a8 a7 a6 a5 a4 nc 48 25 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 nc nc nc a20 nc we# oe# ry/by# dq7 dq6 dq5 dq4 v cc v ss v ss dq3 dq2 dq1 dq0 a0 a1 a2 a3 nc 48-pin standard tsop 1 24 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 nc nc nc a20 nc we# oe# ry/by# dq7 dq6 dq5 dq4 v cc v ss v ss dq3 dq2 dq1 dq0 a0 a1 a2 a3 nc 48 25 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 nc nc nc a19 a18 a17 a16 a15 a14 a13 a12 ce# v cc nc reset# a11 a10 a9 a8 a7 a6 a5 a4 nc 48-pin reverse tsop
am29f016d 8 connection diagrams this device is also available in known good die (kgd) form. refer to publication number 21551 for more information. pin configuration a0?a20 = 21 addresses dq0?dq7 = 8 data inputs/outputs ce# = chip enable we# = write enable oe# = output enable reset# = hardware reset pin, active low ry/by# = ready/busy output v cc = +5.0 v single power supply (see product selector guide for device speed ratings and voltage supply tolerances) v ss = device ground nc = pin not connected internally logic symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 nc reset# a11 a10 a9 a8 a7 a6 a5 a4 nc nc a3 a2 a1 a0 dq0 dq1 dq2 dq3 v ss v ss 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 v cc ce# a12 a13 a14 a15 a16 a17 a18 a19 nc nc a20 nc we# oe# ry/by# dq7 dq6 dq5 dq4 v cc so 21 8 dq0?dq7 a0?a20 ce# oe# we# reset# ry/by#
9 am29f016d ordering information standard products amd standard products are available in several packages and operating ranges. the order number (valid combination) is formed by a combination of the following: valid combinations valid combinations list configurations planned to be sup - ported in volume for this device. consult the local amd sales office to confirm availability of specific valid combinations and to check on newly released combinations. am29f016d -70 e i temperature range c=commercial (0 c to +70 c) d=commercial (0 c to +70 c) with pb-free package i = industrial (?40 c to +85 c) f = industrial (?40 c to +85 c)with pb-free package pac kag e t y pe e = 48-pin thin small outline package (tsop) standard pinout (ts 048) f = 48-pin thin small outline package (tsop) reverse pinout (tsr048) e4 = 40-pin thin small outline package (tsop) standard pinout (ts 040) f4 = 40-pin thin small outline package (tsop) reverse pinout (tsr040) s = 44-pin small outline package (so 044) this device is also available in known good die (kgd) form. see publication number 21551 for more information. speed option see product selector guide and valid combinations device number/description am29f016d 16 megabit (2 m x 8-bit) cmos 5.0 volt-only sector erase flash memory 5.0 v read, program, and erase valid combinations am29f016d-70 ec, ei, fc, fi, ed, ef, e4d, e4f, sd, sf, e4c, e4i, f4c, f4i, sc, si am29f016d-90 ec, ei, fc, fi, e4c, e4i, f4c, f4i, sc, si, ed, ef, e4d, e4f, sd, sf am29f016d-120 am29f016d-150
am29f016d 10 device bus operations this section describes the requirements and use of the device bus operations, which are initiated through the internal command register. the command register it - self does not occupy any addressable memory loca - tion. the register is composed of latches that store the commands, along with the address and data informa - tion needed to execute the command. the contents of the register serve as inputs to the internal state ma - chine. the state machine outputs dictate the function of the device. the appropriate device bus operations table lists the inputs and control levels required, and the resulting output. the following subsections describe each of these operations in further detail. table 1. am29f016d device bus operations legend: l = logic low = v il , h = logic high = v ih , v id = 12.0 0.5 v, x = don?t care, d in = data in, d out = data out, a in = address in note: see the sections on sector group protection and temporary sector unprotect for more information requirements for reading array data to read array data from the outputs, the system must drive the ce# and oe# pins to v il . ce# is the power control and selects the device. oe# is the output control and gates array data to the output pins. we# should re - main at v ih . the internal state machine is set for reading array data upon device power-up, or after a hardware reset. this ensures that no spurious alteration of the mem - ory content occurs during the power transition. no command is necessary in this mode to obtain array data. standard microprocessor read cycles that as - sert valid addresses on the device address inputs produce valid data on the device data outputs. the device remains enabled for read access until the command register contents are altered. see ?reading array data? for more information. refer to the ac read operations table for timing specifica - tions and to the read operations timings diagram for the timing waveforms. i cc1 in the dc characteristics table represents the active current specification for reading array data. writing commands/command sequences to write a command or command sequence (which in - cludes programming data to the device and erasing sectors of memory), the system must drive we# and ce# to v il , and oe# to v ih . an erase operation can erase one sector, multiple sec - tors, or the entire device. the sector address tables in - dicate the address space that each sector occupies. a ?sector address? consists of the address bits required to uniquely select a sector. see the ?command defini - tions? section for details on erasing a sector or the en - tire chip, or suspending/resuming the erase operation. after the system writes the autoselect command se - quence, the device enters the autoselect mode. the system can then read autoselect codes from the inter - nal register (which is separate from the memory array) on dq7?dq0. standard read cycle timings apply in this mode. refer to the ?autoselect mode? and ?autoselect command sequence? sections for more information. i cc2 in the dc characteristics table represents the ac - tive current specification for the write mode. the ?ac characteristics? section contains timing specification tables and timing diagrams for write operations. operation ce# oe# we# reset# a0?a20 dq0?dq7 read l l h h a in d out write l h l h a in d in cmos standby v cc 0.5 v x x v cc 0.5 v x high-z ttl standby h x x h x high-z output disable l h h h x high-z hardware reset x x x l x high-z temporary sector unprotect (see note) x x x v id a in d in
11 am29f016d program and erase operation status during an erase or program operation, the system may check the status of the operation by reading the status bits on dq7?dq0. standard read cycle timings and i cc read specifications apply. refer to ?write operation status? for more information, and to each ac charac - teristics section for timing diagrams. standby mode when the system is not reading or writing to the device, it can place the device in the standby mode. in this mode, current consumption is greatly reduced, and the outputs are placed in the high impedance state, inde - pendent of the oe# input. the device enters the cmos standby mode when ce# and reset# pins are both held at v cc 0.5 v. (note that this is a more restricted voltage range than v ih .) the device enters the ttl standby mode when ce# and reset# pins are both held at v ih . the device re - quires standard access time (t ce ) for read access when the device is in either of these standby modes, before it is ready to read data. the device also enters the standby mode when the re - set# pin is driven low. refer to the next section, ?re - set#: hardware reset pin? . if the device is deselected during erasure or program - ming, the device draws active current until the operation is completed. in the dc characteristics tables, i cc3 represents the standby current specification. reset#: hardware reset pin the reset# pin provides a hardware method of reset - ting the device to reading array data. when the system drives the reset# pin low for at least a period of t rp , the device immediately terminates any operation in progress, tristates all data output pins, and ignores all read/write attempts for the duration of the reset# pulse. the device also resets the internal state ma - chine to reading array data. the operation that was in - terrupted should be reinitiated once the device is ready to accept another command sequence, to ensure data integrity. current is reduced for the duration of the reset# pulse. when reset# is held at v il , the device enters the ttl standby mode; if reset# is held at v ss 0.5 v, the device enters the cmos standby mode. the reset# pin may be tied to the system reset cir - cuitry. a system reset would thus also reset the flash memory, enabling the system to read the boot-up firm - ware from the flash memory. if reset# is asserted during a program or erase oper - ation, the ry/by# pin remains a ?0? (busy) until the in - ternal reset operation is complete, which requires a time of t ready (during embedded algorithms). the system can thus monitor ry/by# to determine whether the reset operation is complete. if reset# is asserted when a program or erase operation is not executing (ry/by# pin is ?1?), the reset operation is completed within a time of t ready (not during embedded algo - rithms). the system can read data t rh after the re - set# pin returns to v ih . refer to the ac characteristics tables for reset# pa - rameters and timing diagram. output disable mode when the oe# input is at v ih , output from the device is disabled. the output pins are placed in the high imped - ance state.
am29f016d 12 table 2. sector address table note: all sectors are 64 kbytes in size. sector a20 a19 a18 a17 a16 address range sa0 0 0 0 0 0 000000h-00ffffh sa1 0 0 0 0 1 010000h-01ffffh sa2 0 0 0 1 0 020000h-02ffffh sa3 0 0 0 1 1 030000h-03ffffh sa4 0 0 1 0 0 040000h-04ffffh sa5 0 0 1 0 1 050000h-05ffffh sa6 0 0 1 1 0 060000h-06ffffh sa7 0 0 1 1 1 070000h-07ffffh sa8 0 1 0 0 0 080000h-08ffffh sa9 0 1 0 0 1 090000h-09ffffh sa10 0 1 0 1 0 0a0000h-0affffh sa11 0 1 0 1 1 0b0000h-0bffffh sa12 0 1 1 0 0 0c0000h-0cffffh sa13 0 1 1 0 1 0d0000h-0dffffh sa14 0 1 1 1 0 0e0000h-0effffh sa15 0 1 1 1 1 0f0000h-0fffffh sa16 1 0 0 0 0 100000h-10ffffh sa17 1 0 0 0 1 110000h-11ffffh sa18 1 0 0 1 0 120000h-12ffffh sa19 1 0 0 1 1 130000h-13ffffh sa20 1 0 1 0 0 140000h-14ffffh sa21 1 0 1 0 1 150000h-15ffffh sa22 1 0 1 1 0 160000h-16ffffh sa23 1 0 1 1 1 170000h-17ffffh sa24 1 1 0 0 0 180000h-18ffffh sa25 1 1 0 0 1 190000h-19ffffh sa26 1 1 0 1 0 1a0000h-1affffh sa27 1 1 0 1 1 1b0000h-1bffffh sa28 1 1 1 0 0 1c0000h-1cffffh sa29 1 1 1 0 1 1d0000h-1dffffh sa30 1 1 1 1 0 1e0000h-1effffh sa31 1 1 1 1 1 1f0000h-1fffffh
13 am29f016d autoselect mode the autoselect mode provides manufacturer and de - vice identification, and sector protection verification, through identifier codes output on dq7?dq0. this mode is primarily intended for programming equipment to automatically match a device to be programmed with its corresponding programming algorithm. however, the autoselect codes can also be accessed in-system through the command register. when using programming equipment, the autoselect mode requires v id (11.5 v to 12.5 v) on address pin a9. address pins a6, a1, and a0 must be as shown in autoselect codes (high voltage method) table. in addi - tion, when verifying sector protection, the sector ad - dress must appear on the appropriate highest order address bits. refer to the corresponding sector ad - dress tables. the command definitions table shows the remaining address bits that are don?t care. when all necessary bits have been set as required, the program - ming equipment may then read the corresponding identifier code on dq7?dq0. to access the autoselect codes in-system, the host system can issue the autoselect command via the command register, as shown in the command defini - tions table. this method does not require v id . see ?command definitions? for details on using the autose - lect mode. table 3. am29f016d autoselect codes (high voltage method) l = logic low = v il , h = logic high = v ih , sa = sector address, x = don?t care. sector group protection/unprotection the hardware sector group protection feature dis - ables both program and erase operations in any sec - tor group. each sector group consists of four adjacent sectors. ta bl e 4 shows how the sectors are grouped, and the address range that each sector group con - tains. the hardware sector group unprotection fea - ture re-enables both program and erase operations in previously protected sector groups. sector group protection/unprotection must be imple - mented using programming equipment. the procedure requires a high voltage (v id ) on address pin a9 and the control pins. details on this method are provided in a supplement, publication number 23922. contact an amd representative to obtain a copy of the appropriate document. note that the sector group protection and unprotection scheme differs from that used with the previous versions of this device, namely the am29f016b and am29f016. the device is shipped with all sector groups unpro - tected. amd offers the option of programming and pro - tecting sector groups at its factory prior to shipping the device through amd?s expressflash? service. con - tact an amd representative for details. it is possible to determine whether a sector group is protected or unprotected. see ?autoselect mode? for details. table 4. sector group addresses temporary sector group unprotect this feature allows temporary unprotection of previ - ously protected sector groups to change data in-sys - tem. the sector group unprotect mode is activated by setting the reset# pin to v id . during this mode, formerly protected sector groups can be programmed or erased by selecting the sector group addresses. description ce# oe# we# a20-a18 a17-a10 a9 a8-a7 a6 a5-a2 a1 a0 dq7-dq0 manufacturer id : amd l l h x x v id x v il x v il v il 01h device id: am29f016d l l h x x v id x v il x v il v ih adh sector group protection verification l l h sector group address x v id x v il x v ih v il 01h (protected) 00h (unprotected) sector group a20 a19 a18 sectors sga0 0 0 0 sa0 ? sa3 sga1 0 0 1 sa4 ? sa7 sga2 0 1 0 sa8 ? sa11 sga3 0 1 1 sa12 ? sa15 sga4 1 0 0 sa16 ? sa19 sga5 1 0 1 sa20 ? sa23 sga6 1 1 0 sa24 ? sa27 sga7 1 1 1 sa28 ? sa31
am29f016d 14 once v id is removed from the reset# pin, all the previously protected sector groups are protected again. figure 1 shows the algorithm, and the temporary sector group unprotect diagram ( fig - ure 16 ) shows the timing waveforms, for this feature. hardware data protection the command sequence requirement of unlock cycles for programming or erasing provides data protection against inadvertent writes (refer to the command defi - nitions table). in addition, the following hardware data protection measures prevent accidental erasure or pro - gramming, which might otherwise be caused by spuri - ous system level signals during v cc power-up and power-down transitions, or from system noise. low v cc write inhibit when v cc is less than v lko , the device does not ac - cept any write cycles. this protects data during v cc power-up and power-down. the command register and all internal program/erase circuits are disabled, and the device resets. subsequent writes are ignored until v cc is greater than v lko . the system must provide the proper signals to the control pins to prevent uninten - tional writes when v cc is greater than v lko . write pulse ?glitch? protection noise pulses of less than 5 ns (typical) on oe#, ce# or we# do not initiate a write cycle. logical inhibit write cycles are inhibited by holding any one of oe# = v il , ce# = v ih or we# = v ih . to initiate a write cy - cle, ce# and we# must be a logical zero while oe# is a logical one. power-up write inhibit if we# = ce# = v il and oe# = v ih during power up, the device does not accept commands on the rising edge of we#. the internal stat e machine is automatically reset to reading array data on power-up. start perform erase or program operations reset# = v ih temporary sector group unprotect completed (note 2) reset# = v id (note 1) notes: 1. all protected sector groups unprotected. 2. all previously protected sector groups are protected once again. figure 1. temporary sector group unprotect operation
15 am29f016d common flash memory interface (cfi) the common flash interface (cfi) specification out - lines device and host system software interrogation handshake, which allows specific vendor-specified software algorithms to be used for entire families of de - vices. software support can then be device-indepen - dent, jedec id-independent, and forward- and backward-compatible for the specified flash device families. flash vendors can standardize their existing interfaces for long-term compatibility. this device enters the cfi query mode when the sys - tem writes the cfi query command, 98h, to address 55h, any time the device is ready to read array data. the system can read cfi information at the addresses given in tables 5 ? 8 . to terminate reading cfi data, the system must write the reset command. the system can also write the cfi query command when the device is in the autoselect mode. the device enters the cfi query mode, and the system can read cfi data at the addresses given in tables 5 ? 8 . the sys - tem must write the reset command to return the device to the autoselect mode. for further information, please refer to the cfi specifi - cation and cfi publication 100, available via the world wide web at http://www.amd.com/products/nvd/over - view/cfi.html. alternatively, contact an amd represen - tative for copies of these documents. table 5. cfi query identification string addresses data description 10h 11h 12h 51h 52h 59h query unique ascii string ?qry? 13h 14h 02h 00h primary oem command set 15h 16h 40h 00h address for primary extended table 17h 18h 00h 00h alternate oem command set (00h = none exists) 19h 1ah 00h 00h address for alternate oem extended table (00h = none exists) table 6. system interface string addresses data description 1bh 45h v cc min. (write/erase) d7?d4: volt, d3?d0: 100 millivolt 1ch 55h v cc max. (write/erase) d7?d4: volt, d3?d0: 100 millivolt 1dh 00h v pp min. voltage (00h = no v pp pin present) 1eh 00h v pp max. voltage (00h = no v pp pin present) 1fh 03h typical timeout per single byte/word write 2 n s 20h 00h typical timeout for min. size buffer write 2 n s (00h = not supported) 21h 0ah typical timeout per individual block erase 2 n ms 22h 00h typical timeout for full chip erase 2 n ms (00h = not supported) 23h 05h max. timeout for byte/word write 2 n times typical 24h 00h max. timeout for buffer write 2 n times typical 25h 04h max. timeout per individual block erase 2 n times typical 26h 00h max. timeout for full chip erase 2 n times typical (00h = not supported)
am29f016d 16 table 7. device geometry definition addresses data description 27h 15h device size = 2 n byte 28h 29h 00h 00h flash device interface description (refer to cfi publication 100) 2ah 2bh 00h 00h max. number of byte in multi-byte write = 2 n (00h = not supported) 2ch 01h number of erase block regions within device 2dh 2eh 2fh 30h 1fh 00h 00h 01h erase block region 1 information (refer to the cfi specification or cfi publication 100) table 8. primary vendor-speci fic extended query addresses data description 40h 41h 42h 50h 52h 49h query-unique ascii string ?pri? 43h 31h major version number, ascii 44h 31h minor version number, ascii 45h 00h address sensitive unlock 0 = required, 1 = not required 46h 02h erase suspend 0 = not supported, 1 = to read only, 2 = to read & write 47h 04h sector protect 0 = not supported, x = number of sectors in per group 48h 01h sector temporary unprotect: 00 = not supported, 01 = supported 49h 04h sector protect/unprotect scheme 01 = 29f040 mode, 02 = 29f016 mode, 03 = 29f400 mode, 04 = 29lv800a mode 4ah 00h simultaneous operation: 00 = not supported, 01 = supported 4bh 00h burst mode type: 00 = not supported, 01 = supported 4ch 00h page mode type: 00 = not supported, 01 = 4 word page, 02 = 8 word page 4dh 00h acc supply minimum 4eh 00h acc supply maximum 4fh 00h top/bottom boot sector flag 2 = bottom, 3 = top. if address 2ch = 01h, ignore this field
17 am29f016d command definitions writing specific address and data commands or se - quences into the command register initiates device op - erations. the command definitions table defines the valid register command sequences. writing incorrect address and data values or writing them in the im - proper sequence resets the device to reading array data. all addresses are latched on the falling edge of we# or ce#, whichever happens later. all data is latched on the rising edge of we# or ce#, whichever happens first. refer to the appropriate timing diagrams in the ?ac characteristics? section. reading array data the device is automatically set to reading array data after device power-up. no commands are required to retrieve data. the device is also ready to read array data after completing an embedded program or em - bedded erase algorithm. after the device accepts an erase suspend command, the device enters the erase suspend mode. the sys - tem can read array data using the standard read tim - ings, except that if it reads at an address within erase- suspended sectors, the device outputs status data. after completing a programming operation in the erase suspend mode, the system may once again read array data with the same exception. see ?erase suspend/ erase resume commands? for more information on this mode. the system must issue the reset command to re-en - able the device for reading array data if dq5 goes high, or while in the autoselect mode. see the ?reset com - mand? section, next. see also ?requirements for reading array data? in the ?device bus operations? section for more information. the read operations table provides the read parame - ters, and read operation timings diagram shows the timing diagram. reset command writing the reset command to the device resets the de - vice to reading array data. address bits are don?t care for this command. the reset command may be written between the se - quence cycles in an erase command sequence before erasing begins. this resets the device to reading array data. once erasure begins, however, the device ig - nores reset commands until the operation is complete. the reset command may be written between the se - quence cycles in a program command sequence be - fore programming begins. this resets the device to reading array data (also applies to programming in erase suspend mode). once programming begins, however, the device ignores reset commands until the operation is complete. the reset command may be written between the se - quence cycles in an autoselect command sequence. once in the autoselect mode, the reset command must be written to return to reading array data (also applies to autoselect during erase suspend). if dq5 goes high during a program or erase operation, writing the reset command returns the device to read - ing array data (also applies during erase suspend). autoselect command sequence the autoselect command sequence allows the host system to access the manufacturer and devices codes, and determine whether or not a sector is protected. the command definitions table shows the address and data requirements. this method is an alternative to that shown in the autoselect codes (high voltage method) table, which is intended for prom program - mers and requires v id on address bit a9. the autoselect command sequence is initiated by writing two unlock cycles, followed by the autoselect command. the device then enters the autoselect mode, and the system may read at any address any number of times, without initiating another command sequence. a read cycle at address xx00h retrieves the manufac - turer code. a read cycle at address xx01h returns the device code. a read cycle containing a sector address (sa) and the address 02h in returns 01h if that sector is protected, or 00h if it is unprotected. refer to the sector address tables for valid sector addresses. the system must write the reset command to exit the autoselect mode and return to reading array data. byte program command sequence programming is a four-bus-cycle operation. the pro - gram command sequence is initiated by writing two un - lock write cycles, followed by the program set-up command. the program address and data are written next, which in turn initiate the embedded program al - gorithm. the system is not required to provide further controls or timings. the device automatically provides internally generated program pulses and verify the pro - grammed cell margin. the command definitions take shows the address and data requirements for the byte program command sequence. when the embedded program algorithm is complete, the device then returns to reading array data and ad - dresses are no longer latched. the system can deter - mine the status of the program operation by using dq7, dq6, or ry/by#. see ?write operation status? for in - formation on these status bits.
am29f016d 18 any commands written to the device during the em - bedded program algorithm are ignored. note that a hardware reset immediately terminates the program - ming operation. the program command sequence should be reinitiated once the device has reset to read - ing array data, to ensure data integrity. programming is allowed in any sequence and across sector boundaries. a bit cannot be programmed from a ?0? back to a ?1?. attempting to do so may halt the operation and set dq5 to ?1?, or cause the data# polling algorithm to indicate the operation was suc - cessful. however, a succeeding read will show that the data is still ?0?. only erase operations can convert a ?0? to a ?1?. unlock bypass command sequence the unlock bypass feature allows the system to pro - gram bytes or words to the device faster than using the standard program command sequence. the unlock by - pass command sequence is initiated by first writing two unlock cycles. this is followed by a third write cycle containing the unlock bypass command, 20h. the de - vice then enters the unlock bypass mode. a two-cycle unlock bypass program command sequence is all that is required to program in this mode. the first cycle in this sequence contains the unlock bypass program command, a0h; the second cycle contains the program address and data. additional data is programmed in the same manner. this mode dispenses with the initial two unlock cycles required in the standard program command sequence, resulting in faster total program - ming time. ta bl e 9 shows the requirements for the com - mand sequence. during the unlock bypass mode, only the unlock by - pass program and unlock bypass reset commands are valid. to exit the unlock bypass mode, the system must issue the two-cycle unlock bypass reset com - mand sequence. the first cycle must contain the data 90h; the second cycle the data 00h. addresses are don?t care for both cycles. the device then returns to reading array data. note: see the appropriate command definitions table for program command sequence. figure 2. program operation chip erase command sequence chip erase is a six-bus-cycle operation. the chip erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. two additional unlock write cycles are then followed by the chip erase command, which in turn invokes the embedded erase algorithm. the device does not require the system to preprogram prior to erase. the embedded erase algo - rithm automatically preprograms and verifies the entire memory for an all zero data pattern prior to electrical erase. the system is not required to provide any con - trols or timings during these operations. the command definitions table shows the address and data require - ments for the chip erase command sequence. start write program command sequence data poll from system verify data? no yes last address? no yes programming completed increment address embedded program algorithm in progress
19 am29f016d any commands written to the chip during the embed - ded erase algorithm are ignored. note that a hardware reset during the chip erase operation immediately ter - minates the operation. the chip erase command se - quence should be reinitiated once the device has returned to reading array data, to ensure data integrity. the system can determine the status of the erase operation by using dq7, dq6, dq2, or ry/by#. see ?write operation status? for information on these status bits. when the embedded erase algorithm is complete, the device returns to reading array data and addresses are no longer latched. figure 3 illustrates the algorithm for the erase opera - tion. see the erase/program operations tables in ?ac characteristics? for parameters, and to the chip/sector erase operation timings for timing waveforms. sector erase command sequence sector erase is a six bus cycle operation. the sector erase command sequence is initiated by writing two un - lock cycles, followed by a set-up command. two addi - tional unlock write cycles are then followed by the address of the sector to be erased, and the sector erase command. the command definitions table shows the address and data requirements for the sec - tor erase command sequence. the device does not require the system to preprogram the memory prior to erase. the embedded erase algo - rithm automatically programs and verifies the sector for an all zero data pattern prior to electrical erase. the system is not required to provide any controls or tim - ings during these operations. after the command sequence is written, a sector erase time-out of 50 s begins. during the time-out period, additional sector addresses and sector erase com - mands may be written. loading the sector erase buffer may be done in any sequence, and the number of sec - tors may be from one sector to all sectors. the time be - tween these additional cycles must be less than 50 s, otherwise the last address and command might not be accepted, and erasure may begin. it is recommended that processor interrupts be disabled during this time to ensure all commands are accepted. the interrupts can be re-enabled after the last sector erase command is written. if the time between additional sector erase commands can be assumed to be less than 50 s, the system need not monitor dq3. any command other than sector erase or erase suspend during the time-out period resets the device to reading array data. the system must rewrite the command sequence and any additional sector addresses and commands. the system can monitor dq3 to determine if the sector erase timer has timed out. (see the ?dq3: sector erase timer? section.) the time-out begins from the rising edge of the final we# pulse in the command sequence. once the sector erase operation has begun, only the erase suspend command is valid. all other commands are ignored. note that a hardware reset during the sector erase operation immediately terminates the op - eration. the sector erase command sequence should be reinitiated once the device has returned to reading array data, to ensure data integrity. when the embedded erase algorithm is complete, the device returns to reading array data and addresses are no longer latched. the system can determine the sta - tus of the erase operation by using dq7, dq6, dq2, or ry/by#. refer to ?write operation status? for informa - tion on these status bits. figure 3 illustrates the algorithm for the erase opera - tion. refer to the erase/program operations tables in the ?ac characteristics? section for parameters, and to the sector erase operations timing diagram for timing waveforms. erase suspend/erase resume commands the erase suspend command allows the system to in - terrupt a sector erase operation and then read data from, or program data to, any sector not selected for erasure. this command is valid only during the sector erase operation, including the 50 s time-out period during the sector erase command sequence. the erase suspend command is ignored if written during the chip erase operation or embedded program algo - rithm. writing the erase suspend command during the sector erase time-out immediately terminates the time-out period and suspends the erase operation. ad - dresses are ?don?t-cares? when writing the erase sus - pend command. when the erase suspend command is written during a sector erase operation, the device requires a maximum of 20 s to suspend the erase operation. however, when the erase suspend command is written during the sector erase time-out, the device immediately ter - minates the time-out period and suspends the erase operation. after the erase operation has been suspended, the system can read array data from or program data to any sector not selected for erasure. (the device ?erase suspends? all sectors selected for erasure.) normal read and write timings and command definitions apply. reading at any address within erase-suspended sec - tors produces status data on dq7?dq0. the system can use dq7, or dq6 and dq2 together, to determine if a sector is actively erasing or is erase-suspended. see ?write operation status? for information on these status bits. after an erase-suspended program operation is com - plete, the system can once again read array data within non-suspended sectors. the system can determine the status of the program operation using the dq7 or
am29f016d 20 dq6 status bits, just as in the standard program oper - ation. see ?write operation status? for more informa - tion. the system may also write the autoselect command sequence when the device is in the erase suspend mode. the device allows reading autoselect codes even at addresses within erasing sectors, since the codes are not stored in the memory array. when the device exits the autoselect mode, the device reverts to the erase suspend mode, and is ready for another valid operation. see ?autoselect command sequence? for more information. the system must write the erase resume command (address bits are ?don?t care?) to exit the erase suspend mode and continue the sector erase operation. further writes of the resume command are ignored. another erase suspend command can be written after the de - vice has resumed erasing. notes: 1. see the appropriate command definitions table for erase command sequence. 2. see ?dq3: sector erase timer? for more information. figure 3. erase operation start write erase command sequence data poll from system data = ffh? no yes erasure completed embedded erase algorithm in progress
21 am29f016d command definitions table 9. am29f016d command definitions legend: x = don?t care ra = address of the memory location to be read. rd = data read from location ra during read operation. pa = address of the memory location to be programmed. addresses latch on the falling edge of the we# or ce# pulse, whichever happens later. pd = data to be programmed at location pa. data latches on the rising edge of we# or ce# pulse, whichever happens first. sa = address of the sector to be verified (in autoselect mode) or erased. address bits a20?a16 select a unique sector. sga = address of the sector group to be verified. address bits a20?a18 select a unique sector group. notes: 1. see table 1 for description of bus operations. 2. all values are in hexadecimal. 3. except when reading array or autoselect data, all bus cycles are write operations. 4. address bits a20?a11 are don?t cares for unlock and command cycles, unless sa or pa required. 5. no unlock or command cycles required when reading array data. 6. the reset command is required to return to reading array data when device is in the autoselect mode, or if dq5 goes high (while the device is providing status data). 7. the fourth cycle of the autoselect command sequence is a read cycle. 8. the data is 00h for an unprotected sector group and 01h for a protected sector group.see ?autoselect command sequence? for more information. 9. command is valid when device is ready to read array data or when device is in autoselect mode. 10. the unlock bypass command is required prior to the unlock bypass program command. 11. the unlock bypass reset command is required to return to reading array data when the device is in the unlock bypass mode. 12. the system may read and program in non-erasing sectors, or enter the autoselect mode, when in the erase suspend mode. the erase suspend command is valid only during a sector erase operation. 13. the erase resume command is valid only during the erase suspend mode. command sequence (note 1) cycles bus cycles (notes 2?4) first second third fourth fifth sixth addr data addr data addr data addr data addr data addr data read (note 5) 1 ra rd reset (note 6) 1 xxx f0 autoselect (note 7) manufacturer id 4 555 aa 2aa 55 555 90 x00 01 device id 4 555 aa 2aa 55 555 90 x01 ad sector group protect verify (note 8) 4 555 aa 2aa 55 555 90 sga x02 xx00 xx01 cfi query (note 9) 1 55 98 program 4 555 aa 2aa 55 555 a0 pa pd unlock bypass 3 555 aa 2aa 55 555 20 unlock bypass program (note 10) 2 xxx a0 pa pd unlock bypass reset (note 11) 2 xxx 90 xxx 00 chip erase 6 555 aa 2aa 55 555 80 555 aa 2aa 55 555 10 sector erase 6 555 aa 2aa 55 555 80 555 aa 2aa 55 sa 30 erase suspend (note 9) 1 xxx b0 erase resume (note 10) 1 xxx 30
am29f016d 22 write operation status the device provides several bits to determine the sta - tus of a write operation: dq 2, dq3, dq5, dq6, dq7, and ry/by#. ta b l e 1 0 and the following subsections describe the functions of these bits. dq7, ry/by#, and dq6 each offer a method for determining whether a program or erase operation is complete or in progress. these three bits are discussed first. dq7: data# polling the data# polling bit, dq7, indicates to the host system whether an embedded algorithm is in progress or completed, or whether the device is in erase suspend. data# polling is valid after the rising edge of the final we# pulse in the program or erase command sequence. during the embedded program algorithm, the device outputs on dq7 the complement of the datum pro - grammed to dq7. this dq7 status also applies to pro - gramming during erase suspend. when the embedded program algorithm is complete, the device outputs the datum programmed to dq7. the system must provide the program address to read valid status information on dq7. if a program address falls within a protected sector, data# polling on dq7 is active for ap - proximately 2 s, then the device returns to reading array data. during the embedded erase algorithm, data# polling produces a ?0? on dq7. when the embedded erase al - gorithm is complete, or if the device enters the erase suspend mode, data# polling produces a ?1? on dq7. this is analogous to the complement/true datum output described for the embedded program algorithm: the erase function changes all the bits in a sector to ?1?; prior to this, the device outputs the ?complement,? or ?0.? the system must provide an address within any of the sectors selected for erasure to read valid status in - formation on dq7. after an erase command sequence is written, if all sec - tors selected for erasing are protected, data# polling on dq7 is active for approximately 100 s, then the de - vice returns to reading array data. if not all selected sectors are protected, the embedded erase algorithm erases the unprotected sectors, and ignores the se - lected sectors that are protected. when the system detects dq7 has changed from the complement to true data, it can read valid data at dq7? dq0 on the following read cycles. this is because dq7 may change asynchronously with dq0?dq6 while output enable (oe#) is asserted low. the data# poll - ing timings (during embedded algorithms) figure in the ?ac characteristics? section illustrates this. table 10 shows the outputs for data# polling on dq7. figure 4 shows the data# polling algorithm. dq7 = data? yes no no dq5 = 1? no yes yes fail pass read dq7?dq0 addr = va read dq7?dq0 addr = va dq7 = data? start notes: 1. va = valid address for programming. during a sector erase operation, a valid address is an address within any sector selected for erasure. during chip erase, a valid address is any non-protected sector address. 2. dq7 should be rechecked even if dq5 = ?1? because dq7 may change simultaneously with dq5. figure 4. data# polling algorithm
23 am29f016d ry/by#: ready/busy# the ry/by# is a dedicated, open-drain output pin that indicates whether an embedded algorithm is in progress or complete. the ry/by# status is valid after the rising edge of the final we# pulse in the command sequence. since ry/by# is an open-drain output, sev - eral ry/by# pins can be tied together in parallel with a pull-up resistor to v cc . if the output is low (busy), the device is actively erasing or programming. (this includes programming in the erase suspend mode.) if the output is high (ready), the device is ready to read array data (including during the erase suspend mode), or is in the standby mode. table 10 shows the outputs for ry/by#. the timing di - agrams for read, reset, program, and erase shows the relationship of ry/by# to other signals. dq6: toggle bit i toggle bit i on dq6 indicates whether an embedded program or erase algorithm is in progress or complete, or whether the device has entered the erase suspend mode. toggle bit i may be read at any address, and is valid after the rising edge of the final we# pulse in the command sequence (prior to the program or erase op - eration), and during the sector erase time-out. during an embedded program or erase algorithm op - eration, successive read cycles to any address cause dq6 to toggle. (the system may use either oe# or ce# to control the read cycles.) when the operation is complete, dq6 stops toggling. after an erase command sequence is written, if all sectors selected for erasing are protected, dq6 tog - gles for approximately 100 s, then returns to reading array data. if not all selected sectors are protected, the embedded erase algorithm erases the unpro - tected sectors, and ignores the selected sectors that are protected. the system can use dq6 and dq2 together to deter - mine whether a sector is actively erasing or is erase- suspended. when the device is actively erasing (that is, the embedded erase algorithm is in progress), dq6 toggles. when the device enters the erase suspend mode, dq6 stops toggling. however, the system must also use dq2 to determine which sectors are erasing or erase-suspended. alternatively, the system can use dq7 (see the subsection on ?dq7: data# polling? ). if a program address falls within a protected sector, dq6 toggles for approximately 2 s after the program command sequence is written, then returns to reading array data. dq6 also toggles during the erase-suspend-program mode, and stops toggling once the embedded pro - gram algorithm is complete. the write operation status table shows the outputs for toggle bit i on dq6. refer to figure 5 for the toggle bit algorithm, and to the toggle bit timings figure in the ?ac characteristics? section for the timing diagram. the dq2 vs. dq6 figure shows the differences be - tween dq2 and dq6 in graphical form. see also the subsection on ?dq2: toggle bit ii? . dq2: toggle bit ii the ?toggle bit ii? on dq2, when used with dq6, indi - cates whether a particular sector is actively erasing (that is, the embedded erase algorithm is in progress), or whether that sector is erase-suspended. toggle bit ii is valid after the rising edge of the final we# pulse in the command sequence. dq2 toggles when the system reads at addresses within those sectors that have been selected for era - sure. (the system may use either oe# or ce# to con - trol the read cycles.) but dq2 cannot distinguish whether the sector is actively erasing or is erase-sus - pended. dq6, by comparison, indicates whether the device is actively erasing, or is in erase suspend, but cannot distinguish which sectors are selected for era - sure. thus, both status bits are required for sector and mode information. refer to table 10 to compare out - puts for dq2 and dq6. figure 5 shows the toggle bit algorithm in flowchart form, and the section ?dq2: toggle bit ii? explains the algorithm. see also the ?dq6: toggle bit i? subsection. refer to the toggle bit timings figure for the toggle bit timing diagram. the dq2 vs . dq6 figure shows the dif - ferences between dq2 and dq6 in graphical form. reading toggle bits dq6/dq2 refer to figure 5 for the following discussion. when - ever the system initially begins reading toggle bit sta - tus, it must read dq7?dq0 at least twice in a row to determine whether a toggle bit is toggling. typically, a system would note and store the value of the toggle bit after the first read. after the second read, the system would compare the new value of the toggle bit with the first. if the toggle bit is not toggling, the device has completed the program or erase operation. the sys - tem can read array data on dq7?dq0 on the following read cycle. however, if after the initial two read cycles, the system determines that the toggle bit is still toggling, the system also should note whether the value of dq5 is high (see the section on dq5). if it is, the system should then determine again whether the toggle bit is toggling, since the toggle bit may have stopped tog - gling just as dq5 went high. if the toggle bit is no longer toggling, the device has successfully completed the program or erase operation. if it is still toggling, the device did not complete the operation successfully, and
am29f016d 24 the system must write the reset command to return to reading array data. the remaining scenario is that the system initially de - termines that the toggle bit is toggling and dq5 has not gone high. the system may continue to monitor the toggle bit and dq5 through successive read cycles, de - termining the status as described in the previous para - graph. alternatively, it may choose to perform other system tasks. in this case, the system must start at the beginning of the algorithm when it returns to determine the status of the operation (top of figure 5 ). dq5: exceeded timing limits dq5 indicates whether the program or erase time has exceeded a specified internal pulse count limit. under these conditions dq5 produces a ?1.? this is a failure condition that indicates the program or erase cycle was not successfully completed. the dq5 failure condition may appear if the system tries to program a ?1? to a location that is previously pro - grammed to ?0.? only an erase operation can change a ?0? back to a ?1.? under this condition, the device halts the operation, and when the operation has ex - ceeded the timing limits, dq5 produces a ?1.? under both these conditions, the system must issue the reset command to return the device to reading array data. dq3: sector erase timer after writing a sector erase command sequence, the system may read dq3 to determine whether or not an erase operation has begun. (the sector erase timer does not apply to the chip erase command.) if addi - tional sectors are selected for erasure, the entire time- out also applies after each additional sector erase command. when the time-out is complete, dq3 switches from ?0? to ?1.? the system may ignore dq3 if the system can guarantee that the time between ad - ditional sector erase commands will always be less than 50 s. see also the ?sector erase command se - quence? section. after the sector erase command sequence is written, the system should read the status on dq7 (data# poll - ing) or dq6 (toggle bit i) to ensure the device has ac - cepted the command sequence, and then read dq3. if dq3 is ?1?, the internally controlled erase cycle has be - gun; all further commands (other than erase suspend) are ignored until the erase operation is complete. if dq3 is ?0?, the device will accept additional sector erase commands. to ensure the command has been accepted, the system software should check the status of dq3 prior to and following each subsequent sector erase command. if dq3 is high on the second status check, the last command might not have been ac - cepted. table 10 shows the outputs for dq3. start no yes yes dq5 = 1? no yes toggle bit = toggle? no program/erase operation not complete, write reset command program/erase operation complete read dq7?dq0 toggle bit = toggle? read dq7?dq0 twice read dq7?dq0 notes: 1. read toggle bit twice to determine whether or not it is toggling. see text. 2. recheck toggle bit because it may stop toggling as dq5 changes to ?1?. see text. figure 5. toggle bit algorithm (notes 1, 2) (note 1)
25 am29f016d table 10. write operation status notes: 1. dq7 and dq2 require a valid address when reading status information. refer to the appropriate subsection for further details. 2. dq5 switches to ?1? when an embedded program or embedded erase operation has exceeded the maximum timing limits. see ?dq5: exceeded timing limits? for more information. operation dq7 (note 1) dq6 dq5 (note 2) dq3 dq2 (note 1) ry/by# standard mode embedded program algorithm dq7# toggle 0 n/a no toggle 0 embedded erase algorithm 0 toggle 0 1 to g g l e 0 erase suspend mode reading within erase suspended sector 1 no toggle 0 n/a to g g l e 1 reading within non-erase suspended sector data data data data data 1 erase-suspend-program dq7# toggle 0 n/a n/a 0
am29f016d 26 absolute maximum ratings storage temperature plastic packages . . . . . . . . . . . . . . . ?65 c to +125 c ambient temperature with power applied. . . . . . . . . . . . . . ?55 c to +125 c voltage with respect to ground v cc (note 1) . . . . . . . . . . . . . . . . . ?2.0 v to 7.0 v a9, oe#, reset# (note 2) . . . . . ?2.0 v to 12.5 v all other pins (note 1) . . . . . . . . . . ?2.0 v to 7.0 v output short circuit current (note 3) . . . . . . 200 ma notes: 1. minimum dc voltage on input or i/o pins is ?0.5 v. during voltage transitions, inputs may overshoot v ss to ?2.0 v for periods of up to 20 ns. see . maximum dc voltage on output and i/o pins is v cc + 0.5 v. during voltage transitions, outputs may overshoot to v cc + 2.0 v for periods up to 20 ns. see . 2. minimum dc input voltage on a9, oe#, reset# pins is ?0.5 v. during voltage transitions, a9, oe#, reset# pins may overshoot v ss to ?2.0 v for periods of up to 20 ns. see . maximum dc input voltage on a9, oe#, and reset# is 12.5 v which may overshoot to 13.5 v for periods up to 20 ns. 3. no more than one output shorted at a time. duration of the short circuit should not be greater than one second. stresses greater than those listed in this section may cause permanent damage to the device. this is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. exposure of the device to absolute maximum rating conditions for extended periods may affect device reliability. operating ranges commercial (c) devices ambient temperature (t c ) . . . . . . . . . . . 0 c to +70 c industrial (i) devices ambient temperature (t c ) . . . . . . . . . ?40 c to +85 c v cc supply voltages v cc for 10% devices . . . . . . . . . . . .+4.5 v to +5.5 v operating ranges define those limits between which the functionality of the device is guaranteed. 20 ns 20 ns +0.8 v ?0.5 v 20 ns ?2.0 v figure 6. maximum negative overshoot waveform 20 ns 20 ns v cc +2.0 v v cc +0.5 v 20 ns 2.0 v figure 7. maximum positive overshoot waveform
27 am29f016d dc characteristics ttl/nmos compatible cmos compatible notes for dc characteristics (both tables): 1. the i cc current is typically less than 1 ma/mhz, with oe# at v ih . 2. i cc active while embedded program or embedded erase algorithm is in progress. 3. not 100% tested. 4. for cmos mode only i cc3 , i cc4 = 20 a at extended temperature (>+85c). parameter symbol parameter description test description min typ max unit i li input load current v in = v ss to v cc , v cc = v cc max 1.0 a i lit a9 input load current v cc = v cc max, a9 = 12.5 v 50 a i lo output leakage current v out = v ss to v cc , v cc = v cc max 1.0 a i cc1 v cc read current (note 1) ce# = v il, oe# = v ih 25 40 ma i cc2 v cc write current (notes 2, 3) ce# = v il, oe# = v ih 40 60 ma i cc3 v cc standby current (ce# controlled) v cc = v cc max, ce# = v ih , reset# = v ih 0.4 1.0 ma i cc4 v cc standby current (reset# controlled) v cc = v cc max, reset# = v il 0.4 1.0 ma v il input low level ?0.5 0.8 v v ih input high level 2.0 v cc + 0.5 v v id voltage for autoselect and sector protect v cc = 5.0 v 11.5 12.5 v v ol output low voltage i ol = 12 ma, v cc = v cc min 0.45 v v oh output high level i oh = ?2.5 ma v cc = v cc min 2.4 v v lko low v cc lock-out voltage 3.2 4.2 v parameter symbol parameter description test description min typ max unit i li input load current v in = v ss to v cc , v cc = v cc max 1.0 a i lit a9 input load current v cc = v cc max, a9 = 12.5 v 50 a i lo output leakage current v out = v ss to v cc , v cc = v cc max 1.0 a i cc1 v cc read current (note 1) ce# = v il, oe# = v ih 25 40 ma i cc2 v cc write current (notes 2, 3) ce# = v il, oe# = v ih 30 40 ma i cc3 v cc standby current (ce# controlled) (note 4) v cc = v cc max, ce# = v cc 0.5 v, reset# = v cc 0.5 v 1 5 a i cc4 v cc standby current (reset# controlled) (note 4) v cc = v cc max, reset# = v ss 0.5 v 1 5 a v il input low level ?0.5 0.8 v v ih input high level 0.7x v cc v cc + 0.3 v v id voltage for autoselect and sector protect v cc = 5.0 v 11.5 12.5 v v ol output low voltage i ol = 12 ma, v cc = v cc min 0.45 v v oh1 output high voltage i oh = ?2.5 ma, v cc = v cc min 0.85 v cc v v oh2 i oh = ?100 a, v cc = v cc min v cc ? 0.4 v v lko low v cc lock-out voltage 3.2 4.2 v
am29f016d 28 test conditions table 11. test specifications key to switching waveforms 2.7 k ? c l 6.2 k ? 5.0 v device under te s t figure 8. test setup note: diodes are in3064 or equivalent test condition all speed options unit output load 1 ttl gate output load capacitance, c l (including jig capacitance) 100 pf input rise and fall times 20 ns input pulse levels 0.45?2.4 v input timing measurement reference levels 0.8 v output timing measurement reference levels 2.0 v ks000010-pal waveform inputs outputs steady changing from h to l changing from l to h don?t care, any change permitted changing, state unknown does not apply center line is high impedance state (high z)
29 am29f016d ac characteristics read-only operations notes: 1. not 100% tested. 2. refer to and for test specifications. parameter symbol parameter description test setup speed options unit jedec std -70 -90 -120 -150 t avav t rc read cycle time (note 1) min 70 90 120 150 ns t avqv t acc address to output delay ce# = v il oe# = v il max 70 90 120 150 ns t elqv t ce chip enable to output delay oe# = v il max 70 90 120 150 ns t glqv t oe output enable to output delay max 40 40 50 55 ns t oeh output enable hold time (note 1) read min 0 0 0 0 ns toggle and data# polling min 10 10 10 10 ns t ehqz t df chip enable to output high z (note 1) max 20 20 30 35 ns t ghqz t df output enable to output high z (note 1) max 20 20 30 35 ns t axqx t oh output hold time from addresses ce# or oe# whichever occurs first min 0 0 0 0 ns t ready reset# pin low to read mode (note 1) max 20 20 20 20 s t ce outputs we# addresses ce# oe# high z output valid high z addresses stable t rc t acc t oeh t oe 0 v ry/by# reset# t df t oh figure 9. read operation timings
am29f016d 30 ac characteristics hardware reset (reset#) note: not 100% tested. parameter description all speed options jedec std test setup unit t ready reset# pin low (during embedded algorithms) to read or write (see note) max 20 s t ready reset# pin low (not during embedded algorithms) to read or write (see note) max 500 ns t rp reset# pulse width min 500 ns t rh reset# high time before read (see note) min 50 ns t rb ry/by# recovery time min 0 ns reset# ry/by# ry/by# t rp t ready reset timings not during embedded algorithms t ready ce#, oe# t rh ce#, oe# reset timings during embedded algorithms reset# t rp t rb figure 10. reset# timings
31 am29f016d ac characteristics erase/program operations notes: 1. not 100% tested. 2. see the ?erase and programming performance? section for more information. parameter parameter description speed options unit jedec std -70 -90 -120 -150 t avav t wc write cycle time (note 1) min 70 90 120 150 ns t avwl t as address setup time min 0 ns t wlax t ah address hold time min 40 45 50 50 ns t dvwh t ds data setup time min 40 45 50 50 ns t whdx t dh data hold time min 0 ns t oes output enable setup time min 0 ns t ghwl t ghwl read recover time before write (oe# high to we# low) min 0 ns t elwl t cs ce# setup time min 0 ns t wheh t ch ce# hold time min 0 ns t wlwh t wp write pulse width min 40 45 50 50 ns t whwl t wph write pulse width high min 20 ns t whwh1 t whwh1 byte programming operation (note 2) ty p 7 s t whwh2 t whwh2 sector erase operation (note 2) ty p 1 sec max 8 sec t vcs v cc set up time (note 1) min 50 s t busy we# to ry/by# valid min 40 40 50 60 ns
am29f016d 32 ac characteristics oe# we# ce# v cc data addresses t ds t ah t dh t wp pd t whwh1 t wc t as t wph t vcs 555h pa pa read status data (last two cycles) a0h t cs status d out program command sequence (last two cycles) ry/by# t rb t busy t ch pa note: pa = program address, pd = program data, d out is the true data at the program address. figure 11. program operation timings
33 am29f016d ac characteristics oe# ce# addresses v cc we# data 2aah sa t ah t wp t wc t as t wph 555h for chip erase 10 for chip erase 30h t ds t vcs t cs t dh 55h t ch in progress complete t whwh2 va va ry/by# t rb t busy note: sa = sector address. va = valid address for reading status data. figure 12. chip/sector erase operation timings
am29f016d 34 ac characteristics we# ce# oe# high z t oe high z dq7 dq0?dq6 ry/by# t busy complement true addresses va t oeh t ce t ch t oh t df va va status data complement status data true valid data valid data t acc t rc note: va = valid address. illustration shows first status cycle after command sequence, last status read cycle, and array data read c ycle. figure 13. data# polling timings (during embedded algorithms) we# ce# oe# high z t oe dq6/dq2 ry/by# t busy addresses va t oeh t ce t ch t oh t df va va t acc t rc valid data valid status valid status (first read) (second read) (stops toggling) valid status va note: va = valid address; not required for dq6. illustration shows first two status cycle after command sequence, last status read cy cle, and array data read cycle. figure 14. toggle bit timings (during embedded algorithms)
35 am29f016d ac characteristics temporary sector unprotect note: not 100% tested. parameter all speed options jedec std description unit t vidr v id rise and fall time (see note) min 500 ns t rsp reset# setup time for temporary sector unprotect min 4 s enter erase erase erase enter erase suspend program erase suspend read erase suspend read erase we# dq6 dq2 erase complete erase suspend suspend program resume embedded erasing note: the system may use oe# or ce# to toggle dq2 and dq6. dq2 toggles only when read at an address within the erase-suspended sector. figure 15. dq2 vs. dq6 reset# t vidr 12 v 0 or 5 v ce# we# ry/by# t vidr t rsp program or erase command sequence 0 or 5 v figure 16. temporary sector group unprotect timings
am29f016d 36 ac characteristics erase and program operations alternate ce# controlled writes notes: 1. not 100% tested. 2. see the ?erase and programming performance? section for more information. parameter symbol parameter description speed options unit jedec std -70 -90 -120 -150 t avav t wc write cycle time (note 1) min 70 90 120 150 ns t avel t as address setup time min 0 ns t elax t ah address hold time min 40 45 50 50 ns t dveh t ds data setup time min 40 45 50 50 ns t ehdx t dh address hold time min 0 ns t ghel t ghel read recover time before write min 0 ns t wlel t ws ce# setup time min 0 ns t ehwh t wh ce# hold time min 0 ns t eleh t cp write pulse width min 40 45 50 50 ns t ehel t cph write pulse width high min 20 ns t whwh1 t whwh1 byte programming operation (note 2) ty p 7 s t whwh2 t whwh2 sector erase operation (note 2) ty p 1 sec max 8 sec
37 am29f016d ac characteristics t ghel t ws oe# ce# we# reset# t ds data t ah addresses t dh t cp dq7# d out t wc t as t cph pa data# polling a0 for program 55 for erase t rh t whwh1 or 2 ry/by# t wh pd for program 30 for sector erase 10 for chip erase xxx for program xxx for erase pa for program sa for sector erase xxx for chip erase t busy notes: 1. pa = program address, pd = program data, sa = sector address, dq7# = complement of data input, d out = array data. 2. figure indicates the last two bus cycles of the command sequence. figure 17. alternate ce# contro lled write operation timings
am29f016d 38 erase and programming performance notes: 1. typical program and erase times assume the following conditions: 25 c, 5.0 v v cc , 1,000,000 cycles. additionally, programming typicals assume checkerboard pattern. 2. under worst case conditions of 90c, v cc = 4.5 v, 1,000,000 cycles. 3. the typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes program faster than the maximum byte program time listed. if the maximum byte program time given is exceeded, only then does the device set dq5 = 1. see the section on dq5 for further information. 4. in the pre-programming step of the embedded erase algorithm, all bytes are programmed to 00h before erasure. 5. system-level overhead is the time required to execute the four-bus-cycle sequence for programming. see table 6 for further information on command definitions. 6. the device has a guaranteed minimum erase and program cycle endurance of 1,000,000 cycles. latchup characteristics note: includes all pins except v cc . test conditions: v cc = 5.0 volt, one pin at a time. tsop and so pin capacitance notes: 1. sampled, not 100% tested. 2. test conditions t a = 25 c, f = 1.0 mhz. data retention parameter typ (note 1) max (note 2) unit comments sector erase time 1 8 sec excludes 00h programming prior to erasure (note 4) chip erase time 32 256 sec byte programming time 7 300 s excludes system-level overhead (note 5) chip programming time (note 3) 14.4 43.2 sec min max input voltage with respect to v ss on i/o pins ?1.0 v v cc + 1.0 v v cc current ?100 ma +100 ma parameter symbol parameter description test conditions min max unit c in input capacitance v in = 0 6 7.5 pf c out output capacitance v out = 0 8.5 12 pf c in2 control pin capacitance v in = 0 7.5 9 pf parameter test conditions min unit minimum pattern data retention time 150 c 10 years 125 c 20 years
39 am29f016d physical dimensions ts 040?40-pin standard thin small outline package dwg rev aa; 10/99
am29f016d 40 physical dimensions (continued) tsr040?40-pin reverse thin small outline package dwg rev aa; 10/99
41 am29f016d physical dimensions (continued) ts 048?48-pin standard thin small outline package dwg rev aa; 10/99
am29f016d 42 physical dimensions (continued) tsr048?48-pin reverse thin small outline package dwg rev aa; 10/99
43 am29f016d physical dimensions (continued) so 044?44-pin small outline package dwg rev ac; 10/99
44 am29f016d revision summary revision a (may 1997) initial release of am29f016b (0.35 m) device. revision b (january 1998) global made formatting and layout consistent with other data sheets. used updated common tables and diagrams. revision b+1 (january 1998) ac characteristics?read-only operations deleted note referring to output driver disable time. figure 16?temporary sector group unprotect timings corrected title to indicate ?sector group.? revision b+2 (april 1998) global added -70 speed option, deleted -75 speed option. distinctive characteristics changed minimum 100k write/erase cycles guaran - teed to 1,000,000. ordering information added extended temperature availability to -90, -120, and -150 speed options. operating ranges added extended temperature range. dc characteristics, cmos compatible corrected the ce# and reset# test conditions for i cc3 and i cc4 to v cc 0.5 v. ac characteristics erase/program operations; erase and program oper - ations alternate ce# controlled writes: corrected the notes reference for t whwh1 and t whwh2 . these param - eters are 100% tested. corrected the note reference for t vcs . this parameter is not 100% tested. temporary sector unprotect table added note reference for t vidr . this parameter is not 100% tested. erase and programming performance changed minimum 100k program and erase cycles guaranteed to 1,000,000. revision c (january 1999) global updated for cs39s process technology. distinctive characteristics added: 20-year data retention at 125 c ? reliable operation for the life of the system dc characteristics?cmos compatible i cc3 , i cc4 : added note 4, ?for cmos mode only i cc3 , i cc4 = 20 a at extended temperature (>+85c)?. dc characteristics?ttl/nmos compatible and cmos compatible i cc1 , i cc2 , i cc3 , i cc4 : added note 2 ?maximum i cc specifications are tested with v cc = v ccmax ?. i cc3 , i cc4 : deleted v cc = v cc max. revision c+1 (march 23, 1999) operating ranges the temperature ranges are now specified as ambient. revision c+2 (may 17, 1999) product selector guide corrected the t oe specification for the -150 speed op - tion to 55 ns. operating ranges v cc supply voltages : added ?v cc for 5% devices . +4.75 v to +5.25 v?. revision c+3 (july 2, 1999) global added references to availability of device in known good die (kgd) form. revision d (november 16, 1999) ac characteristics? figure 11 . program operations timing and figure 12 . chip/sector erase operations deleted t ghwl and changed oe# waveform to start at high. physical dimensions replaced figures with more detailed illustrations.
am29f016d 45 revision e (may 19, 2000) global changed part number to am29f016d. this reflects the new 0.23 m process technology upon which this de - vice will now be built. the am29f016d is compatible with the previous 0.32 m am29f016b device, with the exception of the sec - tor group protect and unprotect algorithms. these algo - rithms are provided in a seperate document. contact amd for more information or to request a copy of that document. this data sheet will be marked preliminary until the de - vice has been in full production for a number of months. the -75 speed option (70 ns, 5% v cc ) has been re - placed by a -70 speed option (70 ns, 10 v cc ). the burn-in option is no longer available. the device now has the unlock bypass program fea - ture. the publication number of the document describing sector protection/unprotection implementation is now 23922. revision e+1 (december 4, 2000) global added table of contents. removed preliminary status from document. revision e+2 (march 23, 2001) common flash memory interface (cfi) added section. table 9 , am29f016d command definitions corrected the addresses for the three-cycle unlock by - pass command sequence. added note 9 and cfi query command to table. revision e+3 (june 4, 2004) ordering information added lead-free (pb-free) options to the temperature range breakout of the opn table and the valid combi - nations table.. copyright ? 2004 advanced micro devices, inc. all rights reserved. amd, the amd logo, and combinations thereof are r egistered trademarks of advanced micro devices, inc. expressflash is a trademark of advanced micro devices, inc. product names used in this publication are for identification pur poses only and may be trademarks of their respective companies .

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